The **ATS-07D-208-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 70mm x 70mm | | **Height (H)** | 6mm (Low Profile) | | **Thermal Resistance** | 10.53°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ## 2. Key Design Components ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a **pushPIN™** system. This consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide a precise, consistent "firm" pressure to ensure maximum contact between the heat sink and the component. ### B. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with **T766 thermal phase change material**. This eliminates the need for manual thermal paste application and ensures an even, air-free bond between the heat sink and the chip. ### C. Fin Profile (High Performance) The "07D" series features a **Straight Fin** design. * **Purpose:** Ideal for systems with high-velocity airflow (fans). * **Low Profile:** At only 6mm high, it is designed for space-constrained environments like 1U rack servers or thin industrial computers. --- ## 3. Thermal Performance Table Thermal resistance determines how effectively the part moves heat away from the silicon. Performance improves as airflow (LFM - Linear Feet per Minute) increases. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 10.53 | | **200** | 6.58 | | **400** | 4.30 | | **600** | 3.24 | --- ## 4. Typical Applications * **Embedded Systems:** Industrial PCs where vertical space is limited. * **Telecommunications:** Cooling of FPGAs or ASICs in networking switches. * **Power Supplies:** Dissipating heat from high-wattage voltage regulators.