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  • ATS-07D-23-C3-R0

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    The **ATS-07D-23-C3-R0** is a specific part number from Advanced Thermal Solutions (ATS). Contrary to being a complex electronic circuit, it is a **High-Performance Passive Heat Sink** designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips. Below is a breakdown of its technical specifications and features. --- ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Product Type** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 60 mm x 60 mm | | **Height** | 12.7 mm | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 12.06 °C/W (at 100 LFM) to 0.90 °C/W (at 700 LFM) | | **Fin Pattern** | Straight | --- ### 2. Key Components & Design #### A. The Fin Design (Straight Fin) The "Straight Fin" design is optimized for environments where there is a consistent, directional airflow. The gaps between the fins allow air to pass through, transferring heat from the aluminum surface to the surrounding air. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or tapes, this part uses a mechanical attachment system: * **Springs:** Provide consistent pressure for optimal thermal interface material (TIM) performance. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). #### C. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. --- ### 3. Application Use Cases This component is typically found in: * **Networking Equipment:** Routers, switches, and gateways. * **Industrial PCs:** Where low-profile cooling (12.7mm height) is required. * **Processors/FPGAs:** Cooling high-speed logic chips that generate significant heat during operation. --- ### 4. Thermal Performance Data *Measured in °C/W (Degrees Celsius per Watt):* | Airflow Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow** | 12.06 | 3.19 | 1.70 | 1.14 | | **Ducted Flow** | 1.61 | 1.05 | 0.86 | 0.77 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted flow in thermal management?
    • ⤷ How do I choose the correct pushPIN size for my PCB thickness?
    • ⤷ Can this heat sink be used with a custom Thermal Interface Material (TIM)?