ATS-07D-23-C3-R0
AI

The **ATS-07D-23-C3-R0** is a specific part number from Advanced Thermal Solutions (ATS). Contrary to being a complex electronic circuit, it is a **High-Performance Passive Heat Sink** designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips.
Below is a breakdown of its technical specifications and features.
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### 1. Technical Specifications
| Feature | Description |
| :--- | :--- |
| **Product Type** | pushPIN™ Heat Sink |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 60 mm x 60 mm |
| **Height** | 12.7 mm |
| **Attachment Method** | pushPIN™ (Spring-loaded bolts) |
| **Thermal Resistance** | 12.06 °C/W (at 100 LFM) to 0.90 °C/W (at 700 LFM) |
| **Fin Pattern** | Straight |
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### 2. Key Components & Design
#### A. The Fin Design (Straight Fin)
The "Straight Fin" design is optimized for environments where there is a consistent, directional airflow. The gaps between the fins allow air to pass through, transferring heat from the aluminum surface to the surrounding air.
#### B. The pushPIN™ Attachment System
Instead of using messy thermal adhesives or tapes, this part uses a mechanical attachment system:
* **Springs:** Provide consistent pressure for optimal thermal interface material (TIM) performance.
* **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB).
#### C. Material and Finish
* **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance.
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### 3. Application Use Cases
This component is typically found in:
* **Networking Equipment:** Routers, switches, and gateways.
* **Industrial PCs:** Where low-profile cooling (12.7mm height) is required.
* **Processors/FPGAs:** Cooling high-speed logic chips that generate significant heat during operation.
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### 4. Thermal Performance Data
*Measured in °C/W (Degrees Celsius per Watt):*
| Airflow Velocity (LFM) | 100 | 300 | 500 | 700 |
| :--- | :--- | :--- | :--- | :--- |
| **Unducted Flow** | 12.06 | 3.19 | 1.70 | 1.14 |
| **Ducted Flow** | 1.61 | 1.05 | 0.86 | 0.77 |
- ⤷
What is the difference between ducted and unducted flow in thermal management?
- ⤷ How do I choose the correct pushPIN size for my PCB thickness?
- ⤷ Can this heat sink be used with a custom Thermal Interface Material (TIM)?