The **ATS-07D-29-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.66 °C/W (at 100 LFM) | | **Flow Direction** | Vertical (Cross-cut) | | **Overall Dimensions** | 45mm x 45mm x 20mm | --- ### 2. Physical Design Features * **Cross-Cut Fin Pattern:** The design features a square-fin or "cross-cut" pattern. This allows for high airflow efficiency as it can accept air from multiple directions, unlike straight-fin heat sinks. * **Push-Pin Attachment:** Instead of messy adhesives or simple clips, this uses a spring-loaded push-pin mechanism. This ensures: * **Consistent Pressure:** Even contact across the electronic component. * **Durability:** Better resistance to vibration and mechanical shock. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized finish increases surface emissivity, which improves heat dissipation via radiation. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-07D-29-C3-R0 depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.66 | | 200 | 2.65 | | 300 | 1.62 | | 400 | 1.25 | | 500 | 1.05 | --- ### 4. Integration with Electronics In an electronic assembly, this part is typically used with: 1. **Thermal Interface Material (TIM):** A pad or paste (like Chomerics T766) is placed between the chip and the heat sink to fill microscopic air gaps. 2. **PCB Mounting Holes:** The PCB must have specific drill holes to accommodate the push-pins (usually 3.175mm diameter). 3. **Active Cooling:** While it can work in passive environments, it is optimized for systems with internal fans.