The **ATS-07D-33-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. --- ## 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 17.50 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Fin Pattern** | Fine-Pitch (Straight) | | **Compression Spring** | ATS-PPS-07 | --- ## 2. Component Breakdown ### A. The Heat Sink Body The body is made of **Aluminum 6063**, which is the industry standard for thermal conductivity and structural integrity. The "Blue Anodized" finish is not just for aesthetics; it provides surface protection against corrosion and slightly improves emissivity for radiant heat transfer. ### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex screws, this part uses the **pushPIN™** system. * **Ease of Use:** Allows for rapid assembly to the PCB. * **Consistent Pressure:** The spring (ATS-PPS-07) ensures that a precise amount of downward force is applied to the electronic component (CPU, GPU, or MOSFET), ensuring an optimal interface with the thermal interface material (TIM). ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**, a high-performance thermal tape/grease. This fills the microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal resistance. --- ## 3. Part Number Decoder (Nomenclature) Understanding the "ATS-07D-33-C3-R0" string helps in identifying variations: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation. * **D**: Attachment style (e.g., Push-pin). * **33**: Size/Form factor code. * **C3**: Thermal performance/material coating code. * **R0**: RoHS compliance and revision status. --- ## 4. Typical Applications This component is designed for cooling integrated circuits (ICs) in heat-sensitive environments: * **Networking Hardware:** Switches, routers, and high-speed modems. * **Embedded Systems:** Industrial controllers and Single Board Computers (SBCs). * **Power Electronics:** Voltage regulators and power transistors.