ATS-07D-35-C3-R0
AI

The **ATS-07D-35-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) designed for cooling integrated circuits (ICs) and other electronic surface-mount components.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 35mm x 35mm x 10mm |
| **Fin Style** | Fine-Pitch |
| **Fin Pattern** | XCUT |
| **Thermal Resistance (Unducted)** | 12.95 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.83 °C/W @ 100 LFM |
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### 2. Key Features and Components
#### A. pushPIN™ Attachment System
Unlike basic adhesive heat sinks, the **ATS-07D-35-C3-R0** uses a mechanical push-pin system.
* **Secure Fit:** Provides consistent pressure to ensure the best thermal interface between the chip and the heat sink.
* **Springs:** Usually paired with high-performance springs to prevent damage to the PCB while maintaining contact.
#### B. XCUT Fin Design
The "XCUT" geometry refers to the way the aluminum fins are shaped. This design is engineered to:
* Increase surface area for heat dissipation.
* Allow for multi-directional airflow, making it effective in systems where air doesn't flow in a single straight line.
#### C. Thermal Interface Material (TIM)
This part typically comes with **T412** thermal interface material (pre-applied phase-change material) on the base. This fills microscopic gaps between the heat sink and the electronic component to maximize heat transfer.
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### 3. Electronic Application
This part is commonly used for cooling the following electronic devices:
1. **Processors (CPUs/GPUs):** Small-form-factor embedded processors.
2. **FPGAs:** High-speed field-programmable gate arrays that generate significant heat.
3. **ASICs:** Application-specific integrated circuits in networking or industrial equipment.
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What are the advantages of using pushPIN attachments over thermal tape?
- ⤷ How does the 'Blue Anodized' finish affect the heat sink's performance?
- ⤷ What is the significance of the 100 LFM airflow measurement in the specifications?