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  • ATS-07D-35-C3-R0

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    The **ATS-07D-35-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) designed for cooling integrated circuits (ICs) and other electronic surface-mount components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Style** | Fine-Pitch | | **Fin Pattern** | XCUT | | **Thermal Resistance (Unducted)** | 12.95 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.83 °C/W @ 100 LFM | --- ### 2. Key Features and Components #### A. pushPIN™ Attachment System Unlike basic adhesive heat sinks, the **ATS-07D-35-C3-R0** uses a mechanical push-pin system. * **Secure Fit:** Provides consistent pressure to ensure the best thermal interface between the chip and the heat sink. * **Springs:** Usually paired with high-performance springs to prevent damage to the PCB while maintaining contact. #### B. XCUT Fin Design The "XCUT" geometry refers to the way the aluminum fins are shaped. This design is engineered to: * Increase surface area for heat dissipation. * Allow for multi-directional airflow, making it effective in systems where air doesn't flow in a single straight line. #### C. Thermal Interface Material (TIM) This part typically comes with **T412** thermal interface material (pre-applied phase-change material) on the base. This fills microscopic gaps between the heat sink and the electronic component to maximize heat transfer. --- ### 3. Electronic Application This part is commonly used for cooling the following electronic devices: 1. **Processors (CPUs/GPUs):** Small-form-factor embedded processors. 2. **FPGAs:** High-speed field-programmable gate arrays that generate significant heat. 3. **ASICs:** Application-specific integrated circuits in networking or industrial equipment.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of using pushPIN attachments over thermal tape?
    • ⤷ How does the 'Blue Anodized' finish affect the heat sink's performance?
    • ⤷ What is the significance of the 100 LFM airflow measurement in the specifications?