The **ATS-07D-36-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "push-pin" attachment series. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height** | 15.00mm | | **Thermal Resistance** | 14.90 °C/W (at 1.0 m/s airflow) | | **Fin Style** | Straight Fin | --- ### 2. Component Breakdown The part number follows a specific nomenclature used by ATS to define the assembly's parts: 1. **ATS-07**: Refers to the specific series and hole pattern for the push-pin mounting. 2. **D**: Typically indicates the attachment hole spacing (e.g., diagonal distance). 3. **36**: Refers to the base size (approximately 36mm). 4. **C3**: Indicates the height and thermal performance profile (15mm height). 5. **R0**: Refers to the specific revision or packaging style (standard blue anodized). --- ### 3. Key Electronic Functions * **Heat Dissipation:** This part is a passive cooling component designed to pull heat away from surface-mount devices (SMDs) such as BGA (Ball Grid Array) processors, FPGAs, or GPUs. * **Mechanical Security:** Unlike adhesive-based heat sinks, the push-pin and spring mechanism provides **consistent pressure**, which improves the contact between the thermal interface material (TIM) and the electronic chip. * **Airflow Efficiency:** The straight-fin design is optimized for environments with consistent directional airflow, allowing air to pass through the channels and carry heat away. --- ### 4. Installation Requirements To use this part on a Printed Circuit Board (PCB), the following must be present: * **Pre-drilled Holes:** The PCB must have two specific holes to accommodate the brass push-pins. * **Thermal Interface Material (TIM):** A thermal pad or grease must be applied between the bottom of the heat sink and the top of the electronic component to bridge microscopic air gaps. ---