The **ATS-07D-40-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 14.71°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **TIM (Interface Material)** | T412 (High performance) | --- ### 2. Key Design Features #### A. Fin Geometry (Cross-Cut) The ATS-07 series utilizes a **cross-cut** fin design. Unlike straight fins, cross-cut fins allow for multi-directional airflow, which is critical in dense PCB environments where air might not flow in a perfectly straight path. #### B. Push-Pin Attachment This part features a mechanical push-pin system. This is superior to adhesive tapes because: * It provides constant **pressure** (preload) for better thermal contact. * It is more reliable under high-vibration or high-temperature conditions. * The pins are designed for specific hole patterns on the PCB. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates it comes pre-applied with **T412**, a high-performance thermal pad. This ensures that there are no air gaps between the heat source and the aluminum base, maximizing heat transfer. --- ### 3. Understanding the Part Number (Suffixes) * **07**: Series designation (pushPIN™). * **D**: Material/Finish variant. * **40**: Specific dimension/geometry code. * **C3**: Thermal Interface Material type (T412). * **R0**: RoHS compliance status and revision. --- ### 4. Application Use-Case This heat sink is typically used for: 1. **Networking Hardware:** Routers and switches with mid-range processing chips. 2. **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators (VRMs) that generate significant heat in a small footprint.