The **ATS-07D-44-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** Heat Sink Assembly series, known for its standardized mounting and high thermal efficiency. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body), Copper (Thermal Interface) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance (Unducted)** | 20.60 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.40 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Pitch** | Fine-Pitch | | **Fin Pattern** | Straight | --- ### 2. Key Electronic Components & Features The "parts" of this assembly include several integrated components that ensure it functions correctly within a circuit: #### A. The Heat Sink Body The main body is made of high-grade aluminum. It uses a **Fine-Pitch Straight-Fin** design. In electronics, the high surface area allows heat to be transferred from the semiconductor junction to the surrounding air via convection. #### B. The pushPIN™ Attachment Unlike adhesive tapes, this part uses a mechanical attachment system: * **Steel Springs:** Provide consistent pressure (force) to ensure maximum contact between the chip and the heat sink. * **Plastic or Brass Pins:** Secure the assembly through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates the specific thermal interface. It usually comes pre-applied with a **Phase Change Material (PCM)** or high-conductivity thermal grease. This fills the microscopic air gaps between the component and the heat sink to reduce thermal impedance. --- ### 3. Application Use Cases * **Telecommunications:** Cooling of high-speed networking chips. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators. * **Embedded Systems:** Industrial PCs where space is limited (15mm height). --- ### 4. Part Number Breakdown ```text ATS - 07 D - 44 - C3 - R0 | | | | | | | | | +-- Revision Code | | | +------- Thermal Interface Material (Pre-Applied) | | +------------ Heat Sink Dimension/Height Code | +------------------- Fin Style/Pitch +------------------------ Manufacturer (Advanced Thermal Solutions) ```