The **ATS-07D-46-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the high-performance push-pin heat sink category designed for cooling integrated circuits (ICs) and other electronic chips. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Part Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 11.87°C/W (at 100 LFM) | | **Thermal Interface Material** | T412 (Double-sided thermal tape) | | **Finish** | Blue Anodized | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the cooling capability and hardware: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: The specific heat sink series. * **D**: Pin material/attachment type. * **46**: Dimensional code (25mm x 25mm base). * **C3**: Height and Fin configuration (15mm Height). * **R0**: Version/Packaging code. --- ### 3. Key Electronic Components Features #### A. Attachment Mechanism The "Push-Pin" design is a critical electronic hardware feature. It uses a spring-loaded mechanism that provides a specific amount of **pressure (force)** on the processor. This ensures optimal contact between the chip surface and the heat sink, preventing air gaps that reduce cooling efficiency. #### B. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**, which is a high-performance thermal pad/tape. In electronics, the TIM is vital because it fills microscopic air gaps between the component and the heat sink, significantly lowering the thermal resistance. #### C. Material & Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This isn't just for aesthetics; the anodized layer provides a small degree of electrical insulation and increases surface emissivity, aiding in radiant heat transfer. --- ### 4. Typical Applications This component is generally used to cool the following electronic parts: 1. **BGA Packages:** Ball Grid Array chips used in networking. 2. **FPGA/ASIC:** High-speed processors that generate significant heat in a small 25x25mm footprint. 3. **Power Converters:** High-density power modules.