The **ATS-07D-47-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation in compact electronic systems. ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 12.5mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine Pitch | | **Fin Pattern** | Straight | | **Thermal Resistance** | 11.58 °C/W (@ 100 LFM / 0.5 m/s) | | **Weight** | ~40 grams | --- ### 2. Key Design Features * **PushPIN™ Attachment:** This mechanism uses a spring-loaded brass pin to ensure constant, reliable pressure between the heat sink and the electronic component (CPU, GPU, or FPGA), maximizing thermal transfer. * **Low Profile:** At only 12.5mm in height, it is designed for environments where vertical space is limited, such as 1U rack servers or thin client hardware. * **Material Efficiency:** The aluminum construction provides a balance between lightweight design and high thermal conductivity. The Blue Anodized finish increases surface emissivity and provides corrosion resistance. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the silicon. Performance varies based on the airflow (Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.58 | | 300 (1.5 m/s) | 4.45 | | 500 (2.5 m/s) | 3.14 | | 700 (3.5 m/s) | 2.58 | --- ### 4. Typical Applications 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Consumer Electronics:** High-speed modems or small-form-factor media players. 4. **Power Supplies:** Cooling of MOSFETs or voltage regulators.