The **ATS-07D-49-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and power modules. ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions and thermal properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Thermal Resistance** | 2.72°C/W (at 200 LFM) | | **Fin Pattern** | Fine Pitch (Cross-cut) | | **Thermal Interface Material** | T412 (Phase change material) | --- ### 2. Key Electronic Components & Design Features #### A. The pushPIN™ Attachment System The "R0" suffix indicates the use of the **pushPIN™** system. This is a mechanical mounting mechanism consisting of a flexible spring and a plastic pin. * **Purpose:** It ensures a precise, high-pressure contact between the heat sink and the electronic chip. * **Benefit:** Provides a secure fit that is resistant to vibration, which is critical for industrial or automotive electronics. #### B. Cross-Cut Fin Design Unlike standard straight-fin heat sinks, the ATS-07D-49-C3-R0 features a cross-cut (mini-pin) fin pattern. * **Airflow:** This design allows for multi-directional airflow, meaning it can dissipate heat effectively regardless of which direction the cooling fan is blowing. * **Efficiency:** Increases the surface area to volume ratio, maximizing cooling in a small 25mm footprint. #### C. Thermal Interface Material (TIM) The base of this heat sink comes pre-applied with **T412**. * **Function:** It fills the microscopic air gaps between the component (chip) and the heat sink. * **Performance:** T412 is a high-performance material that offers low thermal impedance, ensuring heat moves efficiently from the silicon into the aluminum fins. --- ### 3. Application Use Cases This specific part is generally used for small-form-factor electronics where space is limited but heat generation is high: 1. **Network Switches:** Cooling high-speed processing chips. 2. **Embedded Systems:** For industrial PC components that operate in enclosed environments. 3. **Power Converters:** Managing heat in DC-DC voltage regulators.