Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-07D-50-C3-R0

  • AI
    The **ATS-07D-50-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 19.21°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation (Push Pin attachment). * **D**: Material/Color code (typically relates to the specific aluminum grade and blue anodized finish). * **50**: Length/Width dimension indicator (35mm x 35mm in this context). * **C3**: Height code (15mm). * **R0**: Revision or specific packaging/finish indicator. --- ### 3. Key Features & Components #### A. Thermal Performance The heat sink features a **fine-pitch fin design** (typically straight fins), which maximizes the surface area for heat dissipation. This makes it ideal for high-density PCB layouts where airflow may be limited. #### B. Attachment Mechanism Instead of using messy adhesives or thermal tape, this model uses a **push-pin and spring system**. * **Brass Push Pins:** Ensure a secure fit into pre-drilled holes on the PCB. * **Compression Springs:** Provide consistent pressure across the component surface, ensuring optimal thermal contact and preventing the heat sink from shifting during vibration. #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. T412 is a high-performance thermal pad that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. #### D. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides **corrosion resistance** and improves the emissivity of the surface, slightly enhancing radiative heat transfer. --- ### 4. Applications * **Embedded Systems:** Cooling for ARM-based processors. * **Networking:** Used on switches and routers for ASICs and FPGAs. * **Power Electronics:** Small voltage regulators and power modules.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the ATS-07D-50-C3-R0 push pins?
    • ⤷ How does the T412 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used in a passive cooling environment without fans?