The **ATS-07D-51-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Fin Style** | Straight (Push-Pin) | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 6.69°C/W (at 1.0 m/s airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. The Fin Design (High Performance) The "51" series belongs to the **push-PIN™** line. It features a high-density fin structure designed to maximize surface area. Because it uses aluminum, it offers a balance between lightweight construction and high thermal conductivity. #### B. Attachment Mechanism Instead of using messy thermal adhesives or clips, this part uses a **push-pin mechanism**. * **Plastic/Brass Pins:** Provide secure attachment to the PCB. * **Compression Springs:** Ensure a consistent downward pressure (clamping force) for optimal heat transfer between the chip and the sink. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. T766 is a high-performance phase-change material or grease that fills microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown (Nomenclature) To understand the specific electronic properties, here is how the part number is structured: | Prefix | Length/Width | Height | Fin Pattern | Attachment | Color/Material | | :--- | :--- | :--- | :--- | :--- | :--- | | **ATS** | **07D** | **51** | **C2** | **R0** | **Blue Anodized** | | Advanced Thermal Solutions | 35mm Square | 20mm Height | Specific Fin Pitch | Push-pin style | RoHS Compliant | --- ### 4. Implementation Use-Case In an electronic circuit, the **ATS-07D-51-C2-R0** is used when a component's junction temperature ($T_j$) exceeds safe limits. 1. The heat is generated by the **Silicon Die**. 2. It passes through the **T766 TIM**. 3. It conducts into the **Aluminum Base**. 4. It is dissipated into the ambient air via **Convection** through the fins.