The **ATS-07D-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 1.12°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 25mm x 25mm x 25mm | | **Fin Style** | Straight Fin | | **Pressure Requirement** | High Pressure (optimized for 200+ LFM) | --- ### 2. Key Electronic Parts & Design Features #### A. The pushPIN™ Attachment System One of the defining "parts" of this assembly is the mounting mechanism. - It uses a **spring-loaded push-pin** system. - This ensures a constant, predefined pressure (C3 indicates a specific spring force) onto the electronic component (CPU, GPU, or FPGA). - The "C3" in the part number refers to the **spring material/tension**, ensuring optimal thermal interface material (TIM) contact without damaging the PCB. #### B. The Fin Geometry - This model uses a **straight fin** design. - Straight fins are ideal for "ducted" airflow where the direction of the air is predictable. - The 25mm height allows for a large surface area relative to its small 25x25mm footprint, making it suitable for compact power modules. #### C. Thermal Interface Material (TIM) - The part typically comes pre-applied with **T766** or a similar high-performance thermal grease or pad on the base. - This "part" of the assembly is critical for filling microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Application Use Cases This specific heat sink is commonly found in: 1. **Telecommunications equipment** (Routers/Switches). 2. **Embedded Systems** where board space is limited. 3. **Power Supplies** requiring localized cooling for MOSFETs or VRMs. --- ### 4. Part Number Breakdown (Nomenclature) To understand the electronic specifications from the name alone: `ATS - 07 D - 52 - C3 - R0` * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation. * **D**: Fine pitch/Standard pitch indicator. * **52**: Specific dimension/fin configuration code. * **C3**: Spring kit type (Force/Tension). * **R0**: RoHS compliance status (Lead-free).