The **ATS-07D-53-C1-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its technical specifications and physical characteristics. --- ### 1. General Specifications The part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-07D-53-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### 2. Physical Dimensions Precision in dimensions is critical for ensuring the heatsink fits within the PCB layout and clears surrounding components. | Dimension | Measurement | | :--- | :--- | | **Width / Length** | 35.00 mm x 35.00 mm | | **Height (Fin Height)** | 30.00 mm | | **Pitch (Hole spacing)** | 40.00 mm | | **Weight** | ~50 grams | --- ### 3. Thermal Performance Thermal resistance determines how effectively the part dissipates heat away from the semiconductor. * **Thermal Resistance (Unducted Flow):** 8.50 °C/W @ 100 LFM * **Thermal Resistance (Ducted Flow):** 2.00 °C/W @ 100 LFM * **Airflow Direction:** Horizontal (Cross-cut design allows for omnidirectional airflow). --- ### 4. Mounting & Interface The "C1" and "R0" suffixes in the part number refer to the assembly kit and material types. * **Attachment:** Uses a **Push-Pin** mechanism with a brass or plastic pin and a stainless steel spring to provide consistent pressure (TIM compression). * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** (a high-performance thermal phase change material or grease). * **Hardware:** Includes 2-piece push-pin sets for secure PCB mounting. --- ### Summary of Benefits 1. **High Aspect Ratio:** The fins are designed to maximize surface area within a small footprint. 2. **Pre-assembled:** Comes with the attachment hardware, reducing assembly time on the production line. 3. **Reliability:** The spring-loaded mechanism ensures that the heatsink maintains contact with the chip even under mechanical vibration.