The **ATS-07D-55-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 24.11°C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. The Heatsink Body * **Material:** Made of high-grade aluminum for a balance between weight and thermal conductivity. * **Low Profile:** With a height of only 10mm, it is designed for low-clearance environments such as 1U servers or compact embedded systems. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves radiant heat transfer. #### B. The Mounting Mechanism (Push-Pin) * **Hardware:** It utilizes two plastic push-pins and compression springs. * **Benefit:** This provides consistent pressure across the component surface, ensuring optimal contact. It also makes installation faster and tool-less compared to screw-based mounts. * **Hole Pattern:** Designed for specific PCB hole spacings (usually measured diagonally). #### C. Thermal Interface Material (TIM) * **Type:** Pre-applied **T412** phase-change material. * **Function:** This material fills the microscopic air gaps between the component (chip) and the heatsink base, significantly reducing thermal resistance at the contact point. --- ### 3. Application Use Cases This part is typically used in the following electronic assemblies: * **Networking Gear:** Routers, switches, and bridges. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Industrial PCs:** Cooling chips in fanless or low-airflow enclosures. ---