The **ATS-07D-56-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Specification | Details | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Attachment Method** | Push-Pin (2-Pin) | | **Spring Type** | Brass | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Thermal Resistance** | 3.14 °C/W (at 200 LFM) | --- ### 2. Dimensions and Footprint These measurements are critical for ensuring the heat sink fits within the PCB layout and does not interfere with surrounding components. * **Size (L x W):** 40mm x 40mm * **Height:** 15mm * **Pitch:** 47mm (between pins) --- ### 3. Key Electronic/Thermal Features #### A. Advanced Thermal Solutions (ATS) "pushPIN™" This part utilizes the proprietary **pushPIN™** system. Unlike adhesive tapes which can degrade over time, the push-pin mechanism provides a consistent, high-pressure attachment to the PCB. This ensures maximum contact between the component surface and the heat sink base. #### B. T766 Thermal Interface Material The "C3" in the part number indicates the presence of a specific **Thermal Interface Material**. T766 is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. #### C. Straight Fin Design The straight fin geometry is optimized for **forced-air cooling** (airflow from a fan). It allows air to pass through the channels with minimal pressure drop, making it ideal for high-density electronic enclosures. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **07** | Series (pushPIN™ Heat Sink) | | **D** | Material/Pin Type | | **56** | Specific Dimensions/Fin Configuration | | **C3** | Thermal Interface Material (T766) | | **R0** | Revision/Packaging Code |