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  • ATS-07D-57-C3-R0

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    The **ATS-07D-57-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The following table summarizes the primary mechanical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimension (L x W)** | 40mm x 40mm | | **Height** | 15mm | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 13.30°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System This model features the proprietary **pushPIN™** system, which replaces traditional thermal tape or screws. - **Spring Loading:** It provides a precise, calculated pressure (preload) against the electronic component, ensuring maximum thermal contact without damaging delicate silicon dies. - **Hardware:** It typically uses brass or plastic pins with stainless steel springs. #### B. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. In electronics, the TIM is critical because it fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. #### C. Fin Geometry The "Straight Fin" design is optimized for **forced air cooling** (active cooling via a fan). The spacing between the fins is engineered to minimize "pressure drop," allowing air to flow through the sink more efficiently. --- ### 3. Typical Use Cases * **Integrated Circuits (ICs):** Cooling FPGAs or ASICs in telecommunications equipment. * **Embedded Systems:** Use in industrial PCs where space is limited but heat density is high. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ How does the T412 thermal interface material compare to high-performance thermal paste?
    • ⤷ Is the pushPIN system compatible with standard PCB hole patterns?