ATS-07D-57-C3-R0
AI

The **ATS-07D-57-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
### 1. Technical Specifications
The following table summarizes the primary mechanical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (with Blue Anodized finish) |
| **Dimension (L x W)** | 40mm x 40mm |
| **Height** | 15mm |
| **Fin Style** | Straight Fin |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 13.30°C/W (Unducted Flow @ 100 LFM) |
| **Thermal Interface Material (TIM)** | T412 (Pre-applied) |
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### 2. Key Electronic Features
#### A. pushPIN™ Attachment System
This model features the proprietary **pushPIN™** system, which replaces traditional thermal tape or screws.
- **Spring Loading:** It provides a precise, calculated pressure (preload) against the electronic component, ensuring maximum thermal contact without damaging delicate silicon dies.
- **Hardware:** It typically uses brass or plastic pins with stainless steel springs.
#### B. Thermal Interface Material (TIM)
The unit comes with **T412** pre-applied to the base. In electronics, the TIM is critical because it fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance.
#### C. Fin Geometry
The "Straight Fin" design is optimized for **forced air cooling** (active cooling via a fan). The spacing between the fins is engineered to minimize "pressure drop," allowing air to flow through the sink more efficiently.
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### 3. Typical Use Cases
* **Integrated Circuits (ICs):** Cooling FPGAs or ASICs in telecommunications equipment.
* **Embedded Systems:** Use in industrial PCs where space is limited but heat density is high.
* **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
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- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ How does the T412 thermal interface material compare to high-performance thermal paste?
- ⤷ Is the pushPIN system compatible with standard PCB hole patterns?