The **ATS-07D-63-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "push-pin" series designed for securing the cooling solution to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Series** | pushPIN™ | Uses a spring-loaded attachment mechanism | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and prevents corrosion | | **Dimensions (L x W)** | 40mm x 40mm | Standard square footprint for ICs | | **Height (H)** | 20.00 mm | The vertical clearance required | | **Fin Style** | Straight | Optimized for longitudinal airflow | | **Attachment** | Push-Pin | Plastic or Brass pins with springs | --- ### 2. Thermal Performance Heat sinks are rated by their thermal resistance (measured in °C/W). Lower values indicate better heat dissipation. * **Unducted Flow:** Approximately **12.27 °C/W** at 100 LFM (Linear Feet per Minute). * **Ducted Flow:** Approximately **2.48 °C/W** at 100 LFM. * **Optimal Use:** This part is designed for systems with active airflow (fans) rather than passive cooling. --- ### 3. Key Electronic Components & Features #### A. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the `-R0` suffix indicates a specific mounting kit. * **Pre-assembled:** Comes with the push-pin and spring. * **Reliability:** Provides consistent pressure (clamping force) on the high-power component (CPU, GPU, or FPGA), ensuring the Thermal Interface Material (TIM) works effectively. #### B. Thermal Interface Material (TIM) * **Pre-applied:** This specific model usually comes with **ATS-PPS-07** (or similar) pre-applied phase-change material or thermal grease on the base. * **Function:** Fills microscopic air gaps between the component die and the heat sink base to maximize heat transfer. #### C. Aluminum 6063 * The use of 6063-grade aluminum provides a balance between thermal conductivity and structural integrity. --- ### 4. Summary Table of Application | Category | Typical Application | | :--- | :--- | | **Target ICs** | BGA, FPGA, Microprocessors | | **Airflow Direction** | Horizontal / Linear | | **PCB Attachment** | Through-hole (requires 3.175mm holes) | | **Compliance** | RoHS and REACH Compliant | ---