The **ATS-07D-64-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) and surface-mount components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 25.00 mm | | **Pitch** | Fine Pitch | | **Pattern** | Straight Fin | | **Attachment Type** | pushPIN™ (Spring-loaded) | --- ### 2. Electronic/Thermal Performance Thermal resistance is critical in electronic design to prevent component failure due to overheating. The performance varies based on the airflow (velocity) provided by system fans. | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (Unducted) | 9.36 | | 2.0 (Unducted) | 3.12 | | 3.0 (Unducted) | 1.84 | --- ### 3. Key Electronic Design Components #### A. Attachment Mechanism (pushPIN™) Instead of using messy thermal adhesives or tapes, this part uses a **spring-loaded push-pin** system. * **Purpose:** Ensures consistent pressure across the electronic chip, maximizing thermal transfer (TIM efficiency). * **Compatibility:** Designed for pre-drilled holes in the Printed Circuit Board (PCB). #### B. The Interface Material (TIM) The "R0" suffix generally indicates that the part comes with **no thermal interface material** pre-applied, or a specific standard configuration. In an electronic assembly, you would typically apply: * High-conductivity thermal grease. * A phase-change material pad. #### C. Fin Design The **Straight Fin** design is optimized for environments where there is a clear, directional path of airflow. In a dense electronic enclosure, the fine pitch allows for a larger surface area to dissipate heat from the semiconductor die to the ambient air. --- ### 4. Implementation Example If you were designing a PCB for an FPGA or a CPU, you would integrate this part using the following footprint: ```markdown PCB Hole Requirements: - Hole Diameter: 3.175 mm (approx.) - Hole Spacing: 33.00 mm (Pitch) ```