The **ATS-07D-69-C1-R0** is a specific electronic cooling component known as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push pin" attachment series. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Pattern** | Straight Fin | | **Thermal Resistance** | 11.46 °C/W (at 1.0 m/s airflow) | --- ### 2. Key Component Details #### A. The Heat Sink Body The body is made of **Al6063**, a standard aluminum alloy used for its high thermal conductivity. The **Blue Anodized** finish isn't just for aesthetics; it provides surface protection and slightly improves emissivity for radiant heat transfer. #### B. The Push Pin Mechanism Unlike adhesive-based heat sinks, the "C1" in the part number indicates a specific push-pin kit. * **Purpose:** Provides a reliable, consistent pressure against the electronic component (CPU, GPU, or FPGA). * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied. This is a "Phase Change Material" that fills the microscopic gaps between the chip and the heat sink base to maximize heat conduction. --- ### 3. Application Use Cases This part is typically used for cooling integrated circuits (ICs) that generate moderate heat. * **Networking Gear:** Routers, switches, and modems. * **Industrial PCs:** Cooling embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators. --- ### 4. Thermal Performance Context The efficiency of the ATS-07D-69-C1-R0 depends heavily on **Airflow (LFM - Linear Feet per Minute)**: * **Low Airflow (200 LFM):** Resistance is high (approx. 11.46 °C/W). * **High Airflow (500+ LFM):** Resistance drops significantly (approx. 4.0 °C/W), allowing for much cooler operation.