The **ATS-07D-73-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Thermal Resistance (Unducted)** | 14.89 °C/W @ 100 LFM | | **Weight** | ~40-50 grams | --- ### 2. Design Breakdown #### A. The pushPIN™ Attachment System The "73" in the part number indicates a specific hardware configuration. This system uses a flexible, spring-loaded mechanism that provides: * **Constant Pressure:** Ensures the heat sink remains in tight contact with the chip for maximum heat transfer. * **Simplified Assembly:** Pre-assembled with springs and pins for quick installation onto the PCB (Printed Circuit Board). #### B. Thermal Performance The efficiency of this heat sink is measured by its **Thermal Resistance**. At lower airflow (100 LFM), the resistance is high (14.89 °C/W), but as airflow increases to 700 LFM, the resistance drops significantly (to roughly 1.47 °C/W), showing its reliance on active cooling (fans). #### C. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. --- ### 3. Part Number Nomenclature Understanding the ATS naming convention for this part: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **07D** | Series/Product Family | | **73** | Attachment/Hardware code | | **C3** | Thermal Interface Material (TIM) pre-applied | | **R0** | RoHS compliant / Revision | --- ### 4. Application Use-Cases * **Networking Equipment:** Routers and switches where air is forced through the chassis. * **Industrial PCs:** Cooling embedded processors in compact enclosures. * **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units.