ATS-07D-79-C3-R0
AI

The **ATS-07D-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 26.55°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 30mm |
| **Weight** | 35 grams |
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### Key Components & Design Features
#### 1. Heat Sink Profile (The Body)
The body is made of extruded aluminum, chosen for its excellent thermal conductivity and lightweight properties. The "79" in the part number denotes the specific fin geometry and height (30mm), providing a high surface area for convection.
#### 2. pushPIN™ Attachment System
Instead of using messy thermal adhesives or fragile clips, this part uses a mechanical **Push-Pin** system.
* **Compression Spring:** Ensures precise and consistent pressure across the thermal interface.
* **Engagement:** The pins snap into pre-drilled holes on the PCB (Printed Circuit Board).
#### 3. Thermal Interface Material (TIM)
The **"C3"** designation indicates that the heat sink comes pre-applied with a high-performance **T766 Phase Change Material**. This fills microscopic air gaps between the component and the heat sink to maximize heat transfer efficiency.
#### 4. Blue Anodized Finish
The blue coating is not just for aesthetics; anodizing increases surface emissivity (improving radiant heat transfer) and provides a layer of electrical insulation and corrosion resistance.
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### Performance Data
The cooling efficiency depends on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 26.55 |
| 300 | 1.5 | 11.92 |
| 500 | 2.5 | 8.30 |
| 700 | 3.5 | 6.74 |
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### Typical Applications
* **Networking Gear:** Switches and routers.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling voltage regulators or MOSFETs.
- ⤷
How do I calculate the required airflow for this heat sink?
- ⤷ What are the PCB hole diameter requirements for the push-pin attachment?
- ⤷ Can this heat sink be used with a different thermal paste?