ATS-07D-83-C1-R0
AI

The **ATS-07D-83-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm |
| **Thermal Resistance** | 8.52° C/W (@ 100 LFM) |
| **Attachment Method** | pushPIN™ |
| **Fins** | Straight / Square |
| **Compliance** | RoHS Compliant |
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### 2. Design and Engineering Features
#### A. Thermal Performance
The part is engineered to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. The **thermal resistance** varies significantly based on airflow:
* **Low Airflow (100 LFM):** ~8.52° C/W
* **High Airflow (500 LFM):** ~2.31° C/W
#### B. pushPIN™ Attachment System
This component uses the proprietary **pushPIN™** system, which provides several benefits over standard adhesive tapes:
* **Constant Pressure:** A built-in spring ensures consistent contact between the heat sink and the component, optimizing heat transfer.
* **Pre-assembled:** It comes with a pre-drilled hole pattern and hardware for rapid PCB assembly.
* **Secure Fit:** It is more reliable in high-vibration environments compared to clip-on or adhesive solutions.
#### C. Material and Coating
* **Aluminum Construction:** Offers a balance between weight, cost, and thermal conductivity.
* **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases surface emissivity and provides corrosion resistance and electrical insulation to the surface of the sink.
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### 3. Application Use-Cases
Typical applications for this specific heat sink include:
1. **Telecommunications:** Networking switches and routers.
2. **Embedded Systems:** Industrial PCs and controllers.
3. **Power Electronics:** Voltage regulators and motor drives.
4. **Computing:** Chipset cooling on motherboards.
- ⤷
How does the pushPIN™ system compare to traditional thermal adhesive in terms of reliability?
- ⤷ Can you provide the thermal resistance values for this heat sink at 400 LFM?
- ⤷ What are the specific mounting hole requirements for the ATS-07D-83-C1-R0 on a PCB?