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  • ATS-07D-83-C1-R0

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    The **ATS-07D-83-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Thermal Resistance** | 8.52° C/W (@ 100 LFM) | | **Attachment Method** | pushPIN™ | | **Fins** | Straight / Square | | **Compliance** | RoHS Compliant | --- ### 2. Design and Engineering Features #### A. Thermal Performance The part is engineered to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. The **thermal resistance** varies significantly based on airflow: * **Low Airflow (100 LFM):** ~8.52° C/W * **High Airflow (500 LFM):** ~2.31° C/W #### B. pushPIN™ Attachment System This component uses the proprietary **pushPIN™** system, which provides several benefits over standard adhesive tapes: * **Constant Pressure:** A built-in spring ensures consistent contact between the heat sink and the component, optimizing heat transfer. * **Pre-assembled:** It comes with a pre-drilled hole pattern and hardware for rapid PCB assembly. * **Secure Fit:** It is more reliable in high-vibration environments compared to clip-on or adhesive solutions. #### C. Material and Coating * **Aluminum Construction:** Offers a balance between weight, cost, and thermal conductivity. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases surface emissivity and provides corrosion resistance and electrical insulation to the surface of the sink. --- ### 3. Application Use-Cases Typical applications for this specific heat sink include: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and motor drives. 4. **Computing:** Chipset cooling on motherboards.
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN™ system compare to traditional thermal adhesive in terms of reliability?
    • ⤷ Can you provide the thermal resistance values for this heat sink at 400 LFM?
    • ⤷ What are the specific mounting hole requirements for the ATS-07D-83-C1-R0 on a PCB?