The **ATS-07D-87-C3-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component belongs to the "maxiFLOW" product line, designed to provide high thermal performance with minimal pressure drop. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.77°C/W (at 100 LFM) | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height** | 12.70mm | | **Thermal Interface Material (TIM)** | T412 (Phase-change material) | --- ### 2. Design Characteristics The part is engineered for specific electronic cooling requirements: * **Fin Geometry:** It features a "tapered fin" design. This unique shape increases the surface area for heat dissipation while allowing for better airflow intake and exhaust compared to standard square fins. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this model uses a spring-loaded push-pin system. This ensures consistent pressure against the chip for optimal heat transfer and makes it resistant to vibration. * **Thermal Interface Material:** It comes pre-applied with **T412**, a high-quality thermal pad. This eliminates the need for manual application of thermal paste during assembly. --- ### 3. Application Use Cases This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** For industrial computers where space is limited but heat generation is high. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 4. **BGA Components:** Specifically designed to fit standard Ball Grid Array (BGA) chip footprints. --- ### 4. Thermal Performance Comparison Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): * **@ 100 LFM:** 2.77 °C/W (Slow airflow) * **@ 400 LFM:** 1.05 °C/W (Standard fan cooling) * **@ 700 LFM:** 0.80 °C/W (High-speed industrial cooling)