The **ATS-07D-97-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Thermal Resistance** | 20.28°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 10.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Design Components #### A. Fin Design (Straight Fin) The "Straight Fin" design is optimized for environments with a defined airflow direction. Because the fins are parallel, they provide a large surface area for heat exchange while maintaining a relatively low pressure drop for the cooling fans. #### B. Attachment: pushPIN™ System Unlike adhesive-based heat sinks, the **ATS-07D-97-C1-R0** uses a mechanical push-pin mechanism. This offers several advantages: * **Reliability:** Mechanical pins ensure constant pressure on the electronic component, improving thermal contact. * **Easy Maintenance:** The heat sink can be removed and reapplied without damaging the PCB (Printed Circuit Board). * **Compression Spring:** It includes a high-performance spring that compensates for board variations. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance thermal phase-change material. This ensures that the microscopic gaps between the electronic chip and the aluminum heat sink are filled, maximizing heat transfer efficiency. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of networking processors in switches and routers. 2. **Embedded Systems:** For industrial computers where space (10mm height) is limited. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on air velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 20.28 | 5.10 | 2.88 | 2.10 | ---