The **ATS-07E-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications This part is categorized under the **push-pin** heatsink series, designed for easy mechanical attachment to a Printed Circuit Board (PCB). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 26.22°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 15.00 mm | | **Fin Style** | XCUT (Straight Fins with cross-cuts) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ## 2. Component Breakdown ### A. Material and Coating The heatsink is made of **Aluminum**, which offers a balance of high thermal conductivity and low weight. The **Blue Anodized** finish is not just for aesthetics; it increases the surface emissivity, slightly improving radiative heat transfer and protecting the aluminum from corrosion. ### B. XCUT Fin Design The "XCUT" geometry features straight fins that have been cut crosswise. This provides: * **Omnidirectional Airflow:** It can accept air from any direction, making it ideal for systems where the airflow path is not strictly linear. * **Increased Surface Area:** More edges create more turbulence, which breaks up the boundary layer of air and improves heat dissipation. ### C. Attachment Mechanism (Push-Pin) Instead of using messy thermal adhesives or tapes, this part uses **brass push-pins** with a spring-loaded mechanism. * **Reliability:** Provides consistent pressure on the high-power component. * **Maintenance:** Easier to remove and re-install compared to epoxy or permanent adhesives. ### D. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a phase-change material that softens at operating temperatures to fill microscopic air gaps between the chip and the heatsink, ensuring maximum thermal transfer. --- ## 3. Typical Applications This specific size and thermal profile are commonly found in: * **Networking Equipment:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Telecommunications:** Base stations and signal processing units.