The **ATS-07E-06-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *Blue Ice* series, designed for cooling electronic components such as CPUs, GPUs, and high-power semiconductors. --- ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the component: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Mounting Style** | Push-Pin (Plastic) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 20.17°C/W (at 100 LFM) to 4.47°C/W (at 700 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Attachment Method** | ATS-PP-05 (Push-Pin & Spring) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design The "Electronic Parts" of this assembly refers to the mechanical design elements that interact with the circuitry: * **Thermal Interface Material (TIM):** The unit comes with **T766** pre-applied. This is a non-conductive phase-change material that fills microscopic air gaps between the heat sink and the electronic chip (IC) to maximize heat transfer. * **Push-Pin Attachment:** The assembly uses a spring-loaded push-pin mechanism. This ensures a consistent **pressure/clamping force** across the chip, which is critical for preventing mechanical stress on the PCB while maintaining thermal contact. * **Aluminum 6063:** The heat sink is made from an aluminum alloy that offers a balance between weight and high thermal conductivity ($200\text{ W/m}\cdot\text{K}$). --- ### 3. Thermal Performance Analysis The effectiveness of this heat sink depends on the airflow (Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | **100** | 0.5 | 20.17 | | **300** | 1.5 | 9.02 | | **500** | 2.5 | 6.06 | | **700** | 3.5 | 4.47 | --- ### 4. Applications This part is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network processors. 2. **Industrial Controls:** Managing heat in power supply modules. 3. **Embedded Systems:** Suitable for boards where space is constrained but vertical clearance allows for a 25mm height.