The **ATS-07E-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide efficient cooling for electronic components like BGAs, CPUs, and GPUs. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Thermal Resistance (Flow)** | 6.77 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 30.00mm | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ## 2. Key Electronic & Design Components ### A. maxiFLOW™ Heat Sink Design The "maxiFLOW" geometry features a flared fin structure. Unlike standard straight-fin heat sinks, this design increases the surface area for heat dissipation and improves airflow efficiency in constrained spaces. This is critical for preventing thermal throttling in high-speed processors. ### B. pushPIN™ Attachment System This part uses a specific mechanical fastening system: * **Compression Springs:** Provide precise pressure for maximum thermal contact. * **Brass Pins:** Ensure secure attachment to the PCB through pre-drilled holes. * **Reliability:** Unlike adhesive tapes, this mechanical bond is resistant to vibration and thermal expansion cycling. ### C. Thermal Interface Material (TIM) The **C3** in the part number indicates the specific TIM used. * **T766:** This is a high-performance thermal pad/paste pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat source (chip) and the aluminum base, significantly reducing contact resistance. --- ## 3. Part Number Breakdown The part number follows a specific nomenclature: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **07E** | Specific series/design identifier | | **101** | Size/Dimensions code (40x40x30mm) | | **C3** | Thermal Interface Material (T766) | | **R0** | RoHS Compliance status | --- ## 4. Typical Applications This part is commonly used in the following electronic sectors: * **Telecommunications:** Base stations and routers. * **Data Centers:** Server motherboards and cooling for storage controllers. * **Embedded Systems:** Industrial PCs where passive or semi-passive cooling is required.