ATS-07E-124-C2-R0
AI

The **ATS-07E-124-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This part is a passive electronic cooling component designed specifically for electronic packages like BGAs (Ball Grid Arrays).
### 1. Technical Specifications
Below are the primary mechanical and thermal specifications for this part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Heat Sink Type** | Push-Pin (Passive) |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm |
| **Thermal Resistance** | 3.18°C/W (at 100 LFM) |
| **Attachment Method** | Push-Pin with Springs |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
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### 2. Key Features and Design
The "E" in the series designation typically refers to the **push-pin attachment system**, which provides several advantages in electronic assembly:
* **Attachment Mechanism:** It uses a brass push-pin with a stainless steel spring. This ensures consistent pressure across the interface between the heat sink and the chip, improving heat transfer.
* **Fin Pattern:** The part usually features a cross-cut or straight-fin design (depending on the specific revision) optimized for low-to-medium airflow environments.
* **Thermal Interface Material (TIM):** The part comes pre-applied with **T766**, a high-performance thermal phase-change material or grease, which eliminates the need for manual application during assembly.
* **Reliability:** The blue anodized coating provides corrosion resistance and increased surface emissivity, aiding in heat radiation.
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### 3. Application Use Cases
This specific heat sink is typically used in the following electronic cooling scenarios:
1. **Network Switches/Routers:** Cooling high-speed processors or ASICs.
2. **Embedded Systems:** For industrial PCs where vertical space (25mm height) allows for passive airflow.
3. **Power Electronics:** Dissipating heat from MOSFET arrays or power management ICs.
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### 4. Thermal Performance Profile
The efficiency of the ATS-07E-124-C2-R0 depends heavily on the airflow (Measured in Linear Feet per Minute - LFM):
* **@ 100 LFM:** ~3.18 °C/W
* **@ 200 LFM:** ~1.85 °C/W
* **@ 400 LFM:** ~1.30 °C/W
*Note: Lower °C/W values indicate better cooling performance as the airflow increases.*
- ⤷What are the specific hole patterns required on a PCB for this push-pin heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is there a low-profile version of the ATS-124 series for tighter spaces?