The part number **ATS-07E-129-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This component is designed for thermal management of electronic components such as CPUs, GPUs, or power modules. --- ## Technical Specifications The following table outlines the mechanical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (Thermal Interface) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (H)** | 10.00 mm | | **Thermal Resistance** | 8.68°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Interface Material** | T766 (High performance phase change) | --- ## Electronic & Design Features ### 1. Thermal Performance This heat sink is engineered to dissipate heat from surface-mount components. The thermal resistance varies based on airflow: * **Low Airflow (1.0 m/s):** ~8.68 °C/W * **High Airflow (3.5 m/s):** ~2.32 °C/W * **Fin Pitch:** The "XC" pattern design allows for multi-directional airflow, making it efficient for systems where the fan direction might not be perfectly aligned with the fins. ### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical attachment system: * **Compression Springs:** Ensures precise pressure is applied to the component, maximizing thermal contact. * **Plastic/Brass Push Pins:** Provides a secure fit into pre-drilled holes on the PCB, preventing the heat sink from shifting during vibration or shipping. ### 3. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance thermal interface. This eliminates the need for manual application of thermal paste and ensures a uniform, void-free connection between the component die and the heat sink base. --- ## Application Use Cases * **Embedded Systems:** Cooling for small form-factor processors. * **Networking Hardware:** Switches and routers where airflow may be turbulent. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators.