The part number **ATS-07E-149-C2-R0** refers to a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This specific component belongs to their "blue ice" high-performance series designed for cooling electronic components like CPUs, GPUs, or high-power FPGAs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Thermal Resistance** | 6.22°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Brass Spring-loaded pins) | | **Fin Type** | XC-Cut (Cross-Cut) | | **Thermal Interface Material** | T766 (High Performance) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **07:** Indicates the series or product line. * **E:** Material code (often specific to specialized aluminum alloys). * **149:** Designates the specific fin pattern and size (35mm square). * **C2:** Refers to the **Blue Anodized** finish. * **R0:** Revision code (Standard product). --- ### 3. Key Electronic Cooling Features #### **pushPIN™ Attachment System** Unlike adhesive-based heat sinks, this part uses a mechanical spring-loaded pin system. This ensures: * **Consistent Pressure:** Even contact between the heat sink and the chip. * **Reusability:** Can be removed and re-installed during maintenance. * **Stability:** High vibration resistance compared to thermal tape. #### **XC-Cut Fin Design** The "XC-Cut" refers to the cross-cut fin geometry. This creates a larger surface area and allows air to flow through the fins from multiple directions, making it ideal for systems with variable airflow directions (omnidirectional cooling). #### **Thermal Interface Material (TIM)** The **T766** pre-applied material is a high-performance thermal grease or pad that fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal impedance. --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Heat dissipation for MOSFETs or power regulators. * **Industrial PCs:** Cooling embedded processors in compact enclosures.