The part number **ATS-07E-183-C2-R0** refers to a high-performance **Heatsink** manufactured by Advanced Thermal Solutions (ATS). This specific component belongs to the "push-pin" attachment family, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 5.37°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Straight Fin | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Breakdown of the Part Number The alphanumeric string follows a specific coding logic used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation (Push-pin style). * **E**: Performance class/Standard sizing. * **183**: Specific geometry and fin density code. * **C2**: Material and Finish (Aluminum with Blue Anodization). * **R0**: RoHS compliance status and revision. --- ### 3. Key Features * **High Efficiency Fins:** The straight-fin design provides a large surface area for heat dissipation while maintaining low pressure drop, making it ideal for systems with forced-air cooling (fans). * **Push-Pin Attachment:** Features a flexible, spring-loaded push-pin mechanism that ensures consistent pressure on the component, improving thermal transfer. * **Pre-applied TIM:** It comes with a pre-applied Thermal Interface Material (T766), which simplifies the assembly process and ensures a reliable bond between the heat source and the sink. * **Durability:** The blue anodized coating prevents oxidation and increases surface emissivity. --- ### 4. Application Use Cases This component is typically used in environments where electronic components generate significant heat in a confined space: 1. **Telecommunications:** Cooling of networking ASICs and processors. 2. **Industrial Computing:** Maintaining safe operating temperatures for embedded controllers. 3. **Power Supplies:** Dissipating heat from power MOSFETs or VRMs.