The **ATS-07E-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-07E-20-C2-R0 | | **Heat Sink Type** | Push-Pin (BGA) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.14°C/W (at 1.0 m/s airflow) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Phase Change Material) | --- ### 2. Physical Dimensions Understanding the footprint is critical for PCB layout and clearance. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 25.00 mm * **Fin Style:** Straight Fin (Cross-cut) --- ### 3. Key Electronic Components & Design Features #### A. The Heat Sink Body The body is made of high-grade aluminum. Aluminum is preferred in electronics for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish isn't just for aesthetics; it provides surface protection and slightly improves radiant heat emission. #### B. The Push-Pin Attachment The "-R0" suffix refers to the specific attachment kit. This part uses a **Push-Pin** mechanism with a compression spring. This ensures: * **Consistent Pressure:** Even contact between the heat sink and the chip. * **Reliability:** Secure mounting that resists vibration and mechanical shock. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills microscopic air gaps between the component (e.g., a processor) and the heat sink, drastically lowering thermal resistance. #### D. Cross-Cut Fin Design The fins are designed with "cross-cuts." This allows for **Omni-directional airflow**, meaning the heat sink can be cooled effectively regardless of which direction the fan is blowing relative to the board layout. --- ### 4. Part Number Breakdown (Nomenclature) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **07** | Series Identifier | | **E** | Performance/Mounting variant | | **20** | Height or Design specific code | | **C2** | Thermal Performance class/material | | **R0** | Revision/Packaging/Attachment kit |