The part number **ATS-07E-30-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-speed BGA chips. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Dimensions (L x W x H)** | 70.00mm x 45.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance (Unducted)** | 5.31 °C/W @ 200 LFM | | **Finish** | Blue Anodized | --- ### 2. Breakdown of the Part Number The nomenclature for ATS heat sinks provides specific details about the component's build: * **ATS-07**: Series identifier (specifically the Push-Pin series). * **E**: Performance category or specific series revision. * **30**: Typically refers to the fin count or length variation within the family. * **C2**: Indicates the finish (Blue Anodized) and the thermal interface material (TIM) pre-applied. * **R0**: Revision code or RoHS compliance indicator. --- ### 3. Key Electronic Cooling Features 1. **Push Pin Attachment**: This model utilizes a brass push pin with a spring-loaded mechanism. This ensures consistent pressure (clamping force) on the electronic chip, which is critical for maximizing thermal transfer. 2. **Straight Fin Design**: The straight fins are optimized for **forced-air cooling**. They allow air from a system fan to pass through the channels with minimal resistance (low pressure drop). 3. **Blue Anodized Coating**: The anodized finish is not just for aesthetics; it provides increased surface area at a microscopic level and protects the aluminum from corrosion. 4. **Pre-applied TIM**: These units usually come with a high-performance Thermal Interface Material (often a "Phase Change" material) pre-applied to the base to ensure there are no air gaps between the heat sink and the component. --- ### 4. Common Applications * **Networking Equipment**: Switches and routers where high-speed processors generate significant heat. * **Embedded Systems**: Industrial computers requiring rugged mounting (push-pins are more vibration-resistant than adhesive tape). * **Power Electronics**: Cooling MOSFETs or power modules.