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  • ATS-07E-31-C2-R0

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    The **ATS-07E-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 38.00mm x 12.70mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 25.25° C/W (Unducted Flow) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics This heat sink features a **Straight Fin** design, which is optimized for airflow generated by fans. * **Push-Pin Attachment:** It uses a spring-loaded push-pin mechanism. This provides a secure, consistent pressure on the electronic component, which improves thermal transfer and simplifies installation on a PCB (Printed Circuit Board). * **Material Choice:** Aluminum is used because it provides a good balance between thermal conductivity, weight, and cost. * **Blue Anodized Coating:** The surface treatment is not just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. --- ### 3. Thermal Performance vs. Airflow Thermal resistance varies significantly based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 25.25 | | 200 (1.0 m/s) | 11.41 | | 300 (1.5 m/s) | 6.57 | | 400 (2.0 m/s) | 4.73 | | 500 (2.5 m/s) | 3.79 | --- ### 4. Implementation Example When integrating this part into a hardware design, the PCB must have specific hole patterns to accommodate the push-pins. The mechanical footprint is as follows: ```text Pitch Details: - Hole Pitch (X): 47.00 mm - Hole Pitch (Y): 28.50 mm - Pin Material: Plastic (typically POM) - Spring Material: Brass (Nickel Plated) ```
    ✨ Follow-up Questions
    • ⤷ What is the significance of the T766 Thermal Interface Material mentioned?
    • ⤷ How do I calculate if this heat sink is sufficient for a 15W TDP processor?
    • ⤷ Are there alternative attachment methods if my PCB doesn't have push-pin holes?