ATS-07E-31-C2-R0
AI

The **ATS-07E-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 54.00mm x 38.00mm x 12.70mm |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 25.25° C/W (Unducted Flow) |
| **Thermal Interface Material** | T766 (Pre-applied) |
---
### 2. Design Characteristics
This heat sink features a **Straight Fin** design, which is optimized for airflow generated by fans.
* **Push-Pin Attachment:** It uses a spring-loaded push-pin mechanism. This provides a secure, consistent pressure on the electronic component, which improves thermal transfer and simplifies installation on a PCB (Printed Circuit Board).
* **Material Choice:** Aluminum is used because it provides a good balance between thermal conductivity, weight, and cost.
* **Blue Anodized Coating:** The surface treatment is not just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion.
---
### 3. Thermal Performance vs. Airflow
Thermal resistance varies significantly based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 25.25 |
| 200 (1.0 m/s) | 11.41 |
| 300 (1.5 m/s) | 6.57 |
| 400 (2.0 m/s) | 4.73 |
| 500 (2.5 m/s) | 3.79 |
---
### 4. Implementation Example
When integrating this part into a hardware design, the PCB must have specific hole patterns to accommodate the push-pins. The mechanical footprint is as follows:
```text
Pitch Details:
- Hole Pitch (X): 47.00 mm
- Hole Pitch (Y): 28.50 mm
- Pin Material: Plastic (typically POM)
- Spring Material: Brass (Nickel Plated)
```
- ⤷
What is the significance of the T766 Thermal Interface Material mentioned?
- ⤷ How do I calculate if this heat sink is sufficient for a 15W TDP processor?
- ⤷ Are there alternative attachment methods if my PCB doesn't have push-pin holes?