The **ATS-07E-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number encodes specific structural and material characteristics. Here is the breakdown: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Product Series** | pushPIN™ | Uses a specialized attachment mechanism. | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Finish** | Blue Anodized | Enhances surface durability and radiation heat transfer. | | **Dimensions** | 36.83 x 36.83 mm | The footprint area of the heat sink base. | | **Height** | 22.86 mm | Vertical clearance required. | | **Attachment Type** | Push-Pin | Secure mechanical mounting. | | **Thermal Resistance** | 6.42 °C/W (Unducted) | Measures efficiency in heat dissipation. | --- ### 2. Key Features and Components #### A. Fin Design (Cross-Cut) The ATS-07E-38-C2-R0 features a **Cross-Cut** fin pattern. This design allows for: * **Omnidirectional Airflow:** It can receive cooling air from any direction, making it ideal for systems with complex internal air currents. * **Increased Surface Area:** Maximizes the contact between the metal and the air. #### B. The pushPIN™ Attachment System Instead of simple adhesive tape, this part uses a mechanical push-pin system: * **Spring-Loaded Pins:** Provides a precise and consistent pressure (clamping force) on the electronic component, ensuring the thermal interface material (TIM) performs optimally. * **Ease of Install:** Can be installed via pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) Typically, the "R0" designation indicates that the heat sink comes with a **Phase Change Material (PCM)** or high-performance thermal pad pre-applied to the base. This eliminates air gaps between the chip and the heat sink. --- ### 3. Application Use Cases This specific heat sink is used in environments where reliability and high heat dissipation are critical: * **Telecommunications:** Cooling of high-speed network switches. * **Computing:** Secondary cooling for chipsets on motherboards. * **Industrial:** Power supplies and motor controllers that generate significant heat in compact spaces. ---