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  • ATS-07E-50-C2-R0

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    ## ATS-07E-50-C2-R0: Product Overview The **ATS-07E-50-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed to provide efficient thermal management for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-07E-50-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.90° C/W (at 200 LFM) | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision in dimensions is critical for ensuring the heat sink fits within the allocated PCB space without interfering with neighboring components. * **Length:** 30.00 mm * **Width:** 30.00 mm * **Height:** 15.00 mm * **Pitch (Fins):** High-density straight fin design for maximum surface area. --- ### 3. Electronic & Mechanical Components The "parts" of this assembly include more than just the metal block. Here is a breakdown of the electronic-related components: #### A. The Heat Sink Body Made from extruded aluminum, the body uses a straight-fin pattern. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish isn't just for aesthetics; it provides corrosion resistance and increases surface emissivity. #### B. The Push Pin Mounting System The `R0` designation refers to the specific mounting hardware. * **Push Pins:** Made of durable plastic, designed to snap into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a consistent "clamping force" (pressure) between the heat sink and the electronic chip, which is vital for efficient heat transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Composition:** A phase-change or grease-like material that ensures maximum thermal contact. --- ### 4. Performance Context This specific model is designed for **forced air convection** environments. The "C2" in the part number typically denotes the thermal performance grade and attachment style within the ATS product hierarchy. ---
    ✨ Follow-up Questions
    • ⤷ What is the specific clamping force provided by the push pin springs in this model?
    • ⤷ Can the T766 thermal interface material be replaced with a different compound?
    • ⤷ How does the pressure drop of this heat sink affect fan selection?