ATS-07E-50-C2-R0
AI

## ATS-07E-50-C2-R0: Product Overview
The **ATS-07E-50-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed to provide efficient thermal management for electronic components like CPUs, GPUs, and other integrated circuits.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-07E-50-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 1.90° C/W (at 200 LFM) |
| **Attachment Method** | Push Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Physical Dimensions
Precision in dimensions is critical for ensuring the heat sink fits within the allocated PCB space without interfering with neighboring components.
* **Length:** 30.00 mm
* **Width:** 30.00 mm
* **Height:** 15.00 mm
* **Pitch (Fins):** High-density straight fin design for maximum surface area.
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### 3. Electronic & Mechanical Components
The "parts" of this assembly include more than just the metal block. Here is a breakdown of the electronic-related components:
#### A. The Heat Sink Body
Made from extruded aluminum, the body uses a straight-fin pattern. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish isn't just for aesthetics; it provides corrosion resistance and increases surface emissivity.
#### B. The Push Pin Mounting System
The `R0` designation refers to the specific mounting hardware.
* **Push Pins:** Made of durable plastic, designed to snap into pre-drilled holes on the PCB.
* **Compression Springs:** These ensure a consistent "clamping force" (pressure) between the heat sink and the electronic chip, which is vital for efficient heat transfer.
#### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base.
* **Function:** It fills microscopic air gaps between the chip surface and the heat sink base.
* **Composition:** A phase-change or grease-like material that ensures maximum thermal contact.
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### 4. Performance Context
This specific model is designed for **forced air convection** environments. The "C2" in the part number typically denotes the thermal performance grade and attachment style within the ATS product hierarchy.
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- ⤷
What is the specific clamping force provided by the push pin springs in this model?
- ⤷ Can the T766 thermal interface material be replaced with a different compound?
- ⤷ How does the pressure drop of this heat sink affect fan selection?