The **ATS-07E-56-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for high-density electronic cooling applications. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 10.00 mm (Low profile) | | **Fin Style** | Straight (Square-cut) | | **Thermal Resistance** | 17.72 °C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied thermal grease) | --- ### 2. Core Electronic Components The device consists of three primary mechanical/electronic parts integrated into a single cooling solution: 1. **Heat Sink Body:** A precision-machined aluminum block with thin fins designed to increase the surface area for heat dissipation from semiconductors (like CPUs, FPGAs, or MOSFETs). 2. **Push-Pin Mechanism:** Durable brass or plastic pins that provide a standardized attachment force. This ensures the heat sink remains in constant contact with the electronic chip during vibrations or thermal expansion. 3. **Compression Springs:** These provide the necessary "clamping force" to ensure the **Thermal Interface Material (TIM)** is compressed correctly, reducing the air gaps between the chip and the aluminum. --- ### 3. Performance Analysis The efficiency of this part is measured by its ability to move heat away from a component under various airflow conditions (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.72 | | 300 (1.5 m/s) | 6.31 | | 500 (2.5 m/s) | 4.10 | | 700 (3.5 m/s) | 3.20 | --- ### 4. Typical Applications * **Networking Hardware:** Switches and routers where vertical space is limited. * **Embedded Computing:** Industrial PC boards. * **Power Supplies:** Cooling high-wattage voltage regulators. * **Telecom:** Small cell base stations.