ATS-07E-75-C1-R0
AI

The **ATS-07E-75-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic systems.
Below is a detailed breakdown of its specifications and characteristics.
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### 1. General Specifications
| Feature | Details |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-07E-75-C1-R0 |
| **Product Type** | Heat Sink |
| **Series** | pushPIN™ |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
### 2. Physical Dimensions
The dimensions are critical for ensuring the part fits over the integrated circuit (IC) or processor.
* **Length:** 25.00 mm
* **Width:** 25.00 mm
* **Height:** 30.00 mm
* **Pin Pitch:** 30.00 mm (Distance between the attachment holes)
### 3. Material and Finish
The material determines how efficiently heat is conducted away from the electronic component.
* **Material:** Aluminum
* **Finish:** Blue Anodized
* **Thermal Interface Material (TIM):** Pre-applied T766 (High-performance phase change material)
### 4. Thermal Performance
Thermal resistance is measured in Celsius per Watt (°C/W). Lower values indicate better cooling efficiency.
| Airflow Velocity | Thermal Resistance (Unducted) |
| :--- | :--- |
| **100 LFM (0.5 m/s)** | 5.10 °C/W |
| **200 LFM (1.0 m/s)** | 2.40 °C/W |
| **300 LFM (1.5 m/s)** | 2.10 °C/W |
| **400 LFM (2.0 m/s)** | 1.80 °C/W |
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### 5. Key Design Features
* **Fin Type:** Straight-fin design, optimized for airflow in a specific direction.
* **Push-Pin Mounting:** Uses a spring-loaded mechanism that provides consistent pressure for maximum heat transfer and prevents the heat sink from shifting during vibration.
* **Compatibility:** Designed for small form-factor PCBs (Printed Circuit Boards) where space is limited but heat dissipation is critical (e.g., networking chips, small CPUs).
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### Summary of Usage
The **ATS-07E-75-C1-R0** is typically used on surface-mount components that generate significant heat. Engineers choose this part when they need a reliable, tool-less installation (via push-pins) and a high height-to-width ratio (30mm tall) to catch airflow in crowded chassis.
- ⤷What are the advantages of push-pin mounting over adhesive tapes?
- ⤷ How does 'Blue Anodized' finish affect thermal performance?
- ⤷ Is there a low-profile version of this heat sink?