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  • ATS-07E-75-C1-R0

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    The **ATS-07E-75-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic systems. Below is a detailed breakdown of its specifications and characteristics. --- ### 1. General Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07E-75-C1-R0 | | **Product Type** | Heat Sink | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits over the integrated circuit (IC) or processor. * **Length:** 25.00 mm * **Width:** 25.00 mm * **Height:** 30.00 mm * **Pin Pitch:** 30.00 mm (Distance between the attachment holes) ### 3. Material and Finish The material determines how efficiently heat is conducted away from the electronic component. * **Material:** Aluminum * **Finish:** Blue Anodized * **Thermal Interface Material (TIM):** Pre-applied T766 (High-performance phase change material) ### 4. Thermal Performance Thermal resistance is measured in Celsius per Watt (°C/W). Lower values indicate better cooling efficiency. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 5.10 °C/W | | **200 LFM (1.0 m/s)** | 2.40 °C/W | | **300 LFM (1.5 m/s)** | 2.10 °C/W | | **400 LFM (2.0 m/s)** | 1.80 °C/W | --- ### 5. Key Design Features * **Fin Type:** Straight-fin design, optimized for airflow in a specific direction. * **Push-Pin Mounting:** Uses a spring-loaded mechanism that provides consistent pressure for maximum heat transfer and prevents the heat sink from shifting during vibration. * **Compatibility:** Designed for small form-factor PCBs (Printed Circuit Boards) where space is limited but heat dissipation is critical (e.g., networking chips, small CPUs). --- ### Summary of Usage The **ATS-07E-75-C1-R0** is typically used on surface-mount components that generate significant heat. Engineers choose this part when they need a reliable, tool-less installation (via push-pins) and a high height-to-width ratio (30mm tall) to catch airflow in crowded chassis.
    ✨ Follow-up Questions
    • ⤷What are the advantages of push-pin mounting over adhesive tapes?
    • ⤷ How does 'Blue Anodized' finish affect thermal performance?
    • ⤷ Is there a low-profile version of this heat sink?