The **ATS-07E-77-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is part of the "pushPIN™" series manufactured by **Advanced Thermal Solutions (ATS)**. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Fin Style** | Fine Pitch (Cross-cut) | | **Thermal Resistance** | 9.30°C/W (at 100 LFM) | | **Weight** | ~35 grams | --- ## 2. Key Electronic Features ### A. Material & Conductivity The part is fabricated from high-grade aluminum. While aluminum is less conductive than copper, it is significantly lighter and provides excellent surface area for heat dissipation via convection. The **Blue Anodized** finish is not just aesthetic; it provides corrosion resistance and increases surface emissivity. ### B. Thermal Performance Thermal resistance determines how effectively the part moves heat away from a chip. * **Low Airflow (100 LFM):** ~9.30°C/W * **High Airflow (700 LFM):** ~2.60°C/W As airflow increases (measured in Linear Feet per Minute), the efficiency of the part increases dramatically, making it ideal for fan-cooled enclosures. ### C. Mechanical Mounting (pushPIN™) The "R0" designation typically refers to the mounting kit. This part uses a **pushPIN™** system which includes: * A brass or plastic pin. * A stainless steel spring to provide consistent "TIM" (Thermal Interface Material) pressure. * This ensures maximum contact between the chip and the heatsink, reducing the thermal gap. --- ## 3. Applications This specific size (25mm x 25mm) is commonly used for: 1. **Network Switches/Routers:** Cooling small processors or ASICs. 2. **Embedded Systems:** Industrial PCs where space is limited. 3. **Power Supplies:** Regulating heat for MOSFETs or voltage regulators. ---