The **ATS-07E-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs (Printed Circuit Boards). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (Fin height)** | 15.00 mm | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 7.03° C/W @ 100 LFM | | **Flow Direction** | XC Cut (Cross-Cut) | --- ### 2. Key Electronic & Mechanical Components #### A. Fin Design (Cross-Cut) The "XC" in the series indicates a **Cross-Cut** fin pattern. Unlike straight fins, cross-cut fins allow for airflow from any direction (omni-directional). This is critical in cramped electronic enclosures where the fan placement might not align perfectly with the heat sink orientation. #### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or tapes, the **ATS-07E-80-C2-R0** utilizes a mechanical push-pin system. * **Spring-Loaded:** The pins use a compression spring to provide consistent downward pressure on the electronic component (CPU, GPU, or MOSFET). * **Stability:** This prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) This part usually comes pre-applied with **ATS-PPS-07** or similar thermal interface material on the base. This fills the microscopic air gaps between the chip surface and the aluminum base to maximize heat transfer. --- ### 3. Applications This specific heat sink is typically used for cooling the following electronic parts: * **BGA Packages:** Large Ball Grid Array chips. * **FPGA/ASIC:** High-speed processing units that generate significant localized heat. * **Power Supplies:** Voltage regulators and power transistors that require a 30mm footprint. ---