The **ATS-07E-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic application. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, designed for easy installation and high thermal efficiency. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07E-90-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.36°C/W (at 100 LFM) | | **Dimensions** | 35mm x 35mm x 25mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Design & Construction * **Fin Type:** It features a **Straight-Fin** design. This is optimized for specific airflow directions (longitudinal), allowing heat to escape efficiently through the channels. * **Dimensions:** With a 25mm height, it is considered a medium-profile heat sink, suitable for systems where vertical space is available but not unlimited (e.g., 1U or 2U servers). * **Mounting:** It uses a push-pin mechanism with a brass or plastic pin and a high-tension spring. This ensures constant pressure on the electronic component (CPU/GPU/FPGA), which is critical for heat transfer. --- ### 3. Electronic Application This part is typically used to cool high-heat-generating integrated circuits (ICs). * **Target Components:** Microprocessors, Northbridge/Southbridge chipsets, FPGAs, and Power Transistors. * **Thermal Interface (TIM):** The **T766** pre-applied phase-change material fills the microscopic gaps between the heat sink and the chip surface, significantly reducing thermal resistance compared to a dry fit. * **Environmental Rating:** The "C2" in the part number indicates a specific thermal performance grade and material composition meant for standard industrial operating temperatures. --- ### 4. Thermal Performance Comparison The effectiveness of the heat sink depends on the Air Velocity (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.36 | | 300 (1.5 m/s) | 2.42 | | 500 (2.5 m/s) | 1.62 | ---