The **ATS-07E-98-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Part Type** | Heat Sink (Thermal Management) | | **Attachment Method** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions This model is designed for a medium-to-large square footprint, typical for high-speed processors or FPGAs. | Dimension | Measurement (mm) | | :--- | :--- | | **Length** | 45.00 mm | | **Width** | 45.00 mm | | **Height (Fin Height)** | 20.00 mm | | **Pitch (Mounting)** | 38.00 mm | --- ### 3. Thermal Performance Thermal resistance determines how effectively the heat sink transfers heat away from the component into the surrounding air. * **Thermal Resistance (Unducted Flow):** 15.31 °C/W @ 100 LFM * **Thermal Resistance (Ducted Flow):** 2.25 °C/W @ 100 LFM * **Performance Note:** The performance improves significantly as airflow (LFM - Linear Feet per Minute) increases. --- ### 4. Key Electronic Components & Features * **Fin Design:** It utilizes a **cross-cut** fin pattern. This design allows for multidirectional airflow, making it versatile for different system layouts where air might not flow in a single straight path. * **Attachment System:** The `pushPIN™` system ensures a secure fit with a specific pre-drilled PCB hole pattern. This provides consistent pressure (TIM - Thermal Interface Material interface) across the chip surface. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-quality thermal grease or pad that fills microscopic air gaps between the chip and the heat sink. ### 5. Application Use Cases * **Telecommunications:** Cooling high-speed networking chips. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Managing heat for large voltage regulators or power modules.