The **ATS-07F-01-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part: | Parameter | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (Off Base)** | 10.00 mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 22.05°C/W (at 100 LFM) | --- ### 2. Key Features * **pushPIN™ Attachment:** This part utilizes a specialized push-pin mechanism. It uses a flexible spring-loaded design that provides a secure, consistent pressure on the heat source to maximize thermal transfer. * **Fine Pitch Fin Design:** The "F" in the part number often indicates a fine-pitch fin pattern. This increases the surface area for heat dissipation, making it ideal for high-density electronic assemblies. * **Pre-applied Thermal Interface Material (TIM):** Most "R0" variants come with a pre-applied high-performance thermal pad or grease, simplifying the assembly process in a production environment. * **Vibration Resistance:** The spring-loaded pins offer better reliability in environments prone to shock or vibration compared to simple adhesive-based heatsinks. --- ### 3. Electronic Application This part is typically used to cool the following types of electronic components: 1. **Processors (CPUs/GPUs):** Small-form-factor embedded processors. 2. **FPGAs & ASICs:** High-speed logic chips that generate significant heat in localized areas. 3. **Power Modules:** MOSFET arrays or motor drivers that require efficient heat shedding to prevent thermal throttling. 4. **Networking Hardware:** Chipsets in routers and switches. --- ### 4. Part Number Breakdown While manufacturer codes vary, the structure for this ATS series generally follows: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **07:** Series/Base style. * **F:** Fin pitch/Density. * **01:** Specific footprint or height code. * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision or Packaging code.