The **ATS-07F-03-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and features. ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Product Type** | Heatsink with Push-Pin attachment | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring clearance from surrounding components. | Parameter | Measurement | | :--- | :--- | | **Length / Width** | 40.00 mm x 40.00 mm | | **Height** | 15.00 mm | | **Fin Style** | XCUT (Cross-cut for multi-directional airflow) | | **Hole Pattern** | 4-Corner (Industry standard) | --- ### 3. Thermal Performance Thermal resistance indicates how efficiently the part moves heat away from the component. Lower values are better for cooling. * **Thermal Resistance (Unducted Flow):** 15.97 °C/W @ 100 LFM (Linear Feet per Minute) * **Thermal Resistance (Ducted Flow):** 2.56 °C/W @ 100 LFM * **Performance Trend:** As airflow increases (to 700 LFM), the resistance drops significantly, down to approximately 1.08 °C/W. --- ### 4. Mounting and Interface The "C3" and "R0" designations in the part number refer to the mounting hardware and the thermal interface material. * **Attachment Type:** **pushPIN™** system. This uses a spring-loaded pin to provide consistent pressure on the chip. * **Push-Pin Material:** Brass or Plastic (depending on specific revision). * **Springs:** Stainless steel for durability and high retention force. * **Thermal Interface Material (TIM):** T412. This is a pre-applied phase-change material or high-performance thermal pad that ensures maximum heat transfer between the chip and the aluminum base. --- ### 5. Component Application * **Target Components:** BGA (Ball Grid Array) chips, CPUs, GPUs, and FPGAs. * **Airflow Requirement:** Optimized for XCUT airflow, meaning it works well in systems where air might be coming from different angles or in turbulent environments.