The **ATS-07F-07-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin heat sink** category, designed specifically for thermal management in electronic assemblies. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Thermal Resistance** | 16.97°C/W @ Unducted Flow | | **Fin Style** | Fine-Pitch (Straight Fin) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Elements #### A. The Fin Profile The "07" in the series typically indicates a specific fin density and height (12.7mm). This low-profile design is ideal for systems with height constraints (like 1U servers or thin networking switches) where airflow is forced. #### B. Push-Pin Attachment Instead of using messy thermal epoxy or mechanical clips that require tools, this part uses a **spring-loaded push-pin** system. * **Advantage:** Provides consistent pressure on the processor, ensuring optimal thermal contact. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "C1" designation indicates that the heat sink comes with **T766 thermal grease** pre-applied to the base. This simplifies the assembly process on a production line. --- ### 3. Application Use Cases This component is generally used to cool high-heat dissipation chips such as: * **FPGAs** (Field Programmable Gate Arrays) * **ASICs** (Application-Specific Integrated Circuits) * **Network Processors** in routers and switches. * **BGA Packages** where passive cooling is insufficient. --- ### 4. Cooling Performance Summary Below is a simplified breakdown of how the part performs under different airflow conditions (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 7.56 | | 400 (2.0 m/s) | 3.97 | | 600 (3.0 m/s) | 2.85 | *Note: Higher airflow significantly increases the efficiency of this specific straight-fin design.*