The **ATS-07F-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Passive Cooling) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Attachment Method** | Plastic Push-Pin with Brass Springs | | **Thermal Resistance** | 14.60°C/W @ (Natural Convection) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Design Features #### A. Fin Design (Fine Pitch) The "F" in the part number often refers to the fin geometry. This heat sink uses a **cross-cut** or **straight fin** design that maximizes surface area within a small footprint (45mm). This is critical for moving heat from the component surface into the surrounding air. #### B. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a **spring-loaded push-pin** system: - **Ease of Assembly:** Quick installation into pre-drilled holes on a PCB. - **Constant Pressure:** The brass springs provide consistent downward pressure, ensuring optimal contact between the heat sink and the chip. #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. This material fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance compared to dry contact. --- ### 3. Part Number Breakdown (Example) While ATS coding can vary, the typical structure for the `ATS-07F-08-C3-R0` series is: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **07:** Series/Base Size designation. * **F:** Fin style (e.g., Fine pitch). * **08:** Specific height or configuration variant. * **C3:** Material/Color code (typically Blue Anodized Aluminum). * **R0:** RoHS Compliance/Revision status. --- ### 4. Typical Applications * **Networking Equipment:** Routers, switches, and high-speed modems. * **Industrial PCs:** Compact motherboards where vertical space is limited (15mm height). * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Small form factor computing modules. ---