The **ATS-07F-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for cooling integrated circuits (ICs) like CPUs, GPUs, and other power-intensive semiconductors. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 18.74 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Fin Pitch** | COARSE-PITCH | --- ### 2. Key Component Features * **Attachment Mechanism (pushPIN™):** Instead of using messy thermal adhesives or tape, this part uses a spring-loaded push-pin system. This ensures **consistent pressure** across the surface of the electronic component, which is vital for optimal heat transfer. * **Material Composition:** Constructed from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just aesthetic; it provides surface protection and slightly increases emissivity. * **Low Profile:** With a height of only **10mm**, this heat sink is designed for "low-profile" electronic environments where vertical space is constrained (e.g., 1U servers or thin embedded systems). * **Thermal Interface Material (TIM):** This specific part number typically comes pre-applied with **T766** thermal phase change material, which simplifies the assembly process. --- ### 3. Thermal Performance Comparison Thermal performance depends heavily on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure. | Airflow Velocity | 100 LFM (0.5 m/s) | 300 LFM (1.5 m/s) | 500 LFM (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 18.74 °C/W | 6.74 °C/W | 4.30 °C/W | --- ### 4. Implementation Example If your electronic component dissipates **5 Watts** of power and you have an airflow of 300 LFM: ```python # Calculation of temperature rise (Delta T) power_watt = 5.0 thermal_resistance = 6.74 # at 300 LFM temp_rise = power_watt * thermal_resistance print(f"The component temperature will rise {temp_rise}°C above ambient.") # Result: 33.7°C ```