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  • ATS-07F-113-C3-R0

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    The **ATS-07F-113-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 11.90°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Thermal Interface Material** | T412 (Pre-applied) | --- ## Key Components and Features ### 1. The Fin Profile (Heat Sink Body) * **Design:** This model uses a **straight-fin** design. This is ideal for applications where there is a consistent, directional airflow. * **Surface Area:** The 40mm x 40mm footprint provides a balanced surface area for mid-range heat dissipation in compact spaces. * **Low Profile:** With a height of only 10mm, it is suitable for 1U server racks or small form factor (SFF) electronics. ### 2. Attachment Mechanism (Push-Pin) * **Hardware:** It utilizes plastic or brass push-pins with springs. * **Function:** The springs provide a consistent **compression force** on the component, ensuring high thermal contact while allowing for easy installation without tools. * **Hole Pattern:** Designed for specific PCB hole spacings (usually 33mm in this series). ### 3. Thermal Interface Material (TIM) * The **T412** coating is pre-applied to the base of the heat sink. * **Benefit:** It fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance compared to dry contact. ### 4. Anodized Finish * The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. --- ## Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 11.90 | | **300 (1.5 m/s)** | 5.80 | | **500 (2.5 m/s)** | 4.40 | | **700 (3.5 m/s)** | 3.70 | ---
    ✨ Follow-up Questions
    • ⤷ What is the exact mounting hole spacing required for this heat sink?
    • ⤷ Can the T412 thermal interface material be replaced with standard thermal paste?
    • ⤷ Is this heat sink compatible with natural convection cooling
    • ⤷ or does it require a fan?