ATS-07F-113-C3-R0
AI

The **ATS-07F-113-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## Technical Specifications
The part number follows a specific nomenclature used by ATS. Below are the primary specifications for this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin |
| **Thermal Resistance** | 11.90°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm |
| **Thermal Interface Material** | T412 (Pre-applied) |
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## Key Components and Features
### 1. The Fin Profile (Heat Sink Body)
* **Design:** This model uses a **straight-fin** design. This is ideal for applications where there is a consistent, directional airflow.
* **Surface Area:** The 40mm x 40mm footprint provides a balanced surface area for mid-range heat dissipation in compact spaces.
* **Low Profile:** With a height of only 10mm, it is suitable for 1U server racks or small form factor (SFF) electronics.
### 2. Attachment Mechanism (Push-Pin)
* **Hardware:** It utilizes plastic or brass push-pins with springs.
* **Function:** The springs provide a consistent **compression force** on the component, ensuring high thermal contact while allowing for easy installation without tools.
* **Hole Pattern:** Designed for specific PCB hole spacings (usually 33mm in this series).
### 3. Thermal Interface Material (TIM)
* The **T412** coating is pre-applied to the base of the heat sink.
* **Benefit:** It fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance compared to dry contact.
### 4. Anodized Finish
* The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer.
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## Thermal Performance Data
Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (0.5 m/s)** | 11.90 |
| **300 (1.5 m/s)** | 5.80 |
| **500 (2.5 m/s)** | 4.40 |
| **700 (3.5 m/s)** | 3.70 |
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- ⤷
What is the exact mounting hole spacing required for this heat sink?
- ⤷ Can the T412 thermal interface material be replaced with standard thermal paste?
- ⤷ Is this heat sink compatible with natural convection cooling
- ⤷ or does it require a fan?